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NVBLS1D5N10MCTXG - onsemi

Description: Low RDS(on); Low QG and Capacitance; RoHS Compliant ; AEC Q101- Qualified and PPAP Capable

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NVBLS1D5N10MCTXG - onsemi PCB footprint - Other - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE A
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NVBLS1D5N10MCTXG - onsemi  - 3D model - Other - H−PSOF8L 11.68x9.80 CASE 100CU ISSUE A
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NVBLS1D5N10MCTXG Details

  • Manufacturer Part Number:

    NVBLS1D5N10MCTXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-LL 8L

  • Package Description:

    H-PSOF8L, 8 PIN

  • Manufacturer Package Code:

    100CU

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    1652 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    300 A

  • Drain-source On Resistance-Max:

    0.0015 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    84 pF

  • JEDEC-95 Code:

    MO-299A

  • JESD-30 Code:

    R-PSSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    331 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVBLS1D5N10MCTXG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable heat sink, and implement thermal management techniques such as thermal monitoring and cooling systems.
  • The NVBLS1D5N10MCTXG has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing, and to use ESD protection devices in the system design.
  • Yes, the NVBLS1D5N10MCTXG is suitable for high-reliability and automotive applications, as it meets the relevant industry standards and has been qualified for use in these environments.
  • To troubleshoot issues with the device, start by reviewing the datasheet and application notes, then use debugging tools such as oscilloscopes and logic analyzers to identify the root cause of the problem.

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NVBLS1D5N10MCTXG Overview

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