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NVH4L018N075SC1 - onsemi

Description: Qualified for Automotive According to AEC−Q101; 750V rated; Max RDS(on) = 18 mΩ at Vgs = 18V, Id = 75A; High Speed Switching and Low Capacitance; 100% UIL Tested; Devices are RoHS Compliant

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NVH4L018N075SC1 - onsemi PCB footprint - Other - Other - NVH4L018N075SC1-2
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NVH4L018N075SC1 - onsemi  - 3D model - Other - NVH4L018N075SC1-2
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NVH4L018N075SC1 Details

  • Manufacturer Part Number:

    NVH4L018N075SC1

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247-4

  • Manufacturer Package Code:

    340CJ

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    162 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    750 V

  • Drain Current-Max (ID):

    140 A

  • Drain-source On Resistance-Max:

    0.018 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    31 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    500 W

  • Pulsed Drain Current-Max (IDM):

    483 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

NVH4L018N075SC1 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the top and bottom layers connected to the drain pin, and to use thermal vias to connect the top and bottom layers. This will help to dissipate heat efficiently.
  • To ensure the device is properly biased, make sure to follow the recommended biasing conditions in the datasheet, including the gate-source voltage, drain-source voltage, and current. Additionally, ensure that the device is operated within the recommended temperature range.
  • Operating the device beyond the recommended temperature range can lead to reduced performance, decreased reliability, and potentially even device failure. It's essential to ensure that the device is operated within the recommended temperature range to ensure optimal performance and longevity.
  • To protect the device from ESD, follow proper handling and storage procedures, such as using anti-static bags, wrist straps, and mats. Additionally, ensure that the device is properly grounded during assembly and testing.
  • The recommended soldering conditions for this device are typically specified in the datasheet or in a separate application note. In general, it's recommended to use a soldering temperature of around 250°C to 260°C, with a soldering time of around 3-5 seconds.

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NVH4L018N075SC1 Overview

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