A good PCB layout should ensure minimal thermal resistance, use a thermal pad, and have a solid ground plane. A heat sink or thermal interface material can be used to improve thermal management. Consult onsemi's application notes and thermal management guidelines for more information.
Choose a gate driver that can provide a high enough gate current and voltage to ensure the MOSFET turns on and off quickly. Consider the driver's output current, voltage, and rise/fall times. onsemi recommends using a gate driver with a output current of at least 1A and a voltage rating of 10V or higher.
The maximum allowed voltage ringing on the drain-source pins is typically limited to 20-30% of the MOSFET's rated voltage. Excessive ringing can lead to reduced reliability and lifespan. Use a snubber circuit or a gate driver with built-in voltage clamping to minimize ringing.
To ensure SOA compliance, calculate the MOSFET's power dissipation and ensure it stays within the specified limits. Consider factors like voltage, current, and temperature. Use onsemi's SOA curves and application notes to determine the safe operating area for your specific design.
Handle the MOSFET by the body or use an ESD wrist strap to prevent damage. Use an ESD-protected workstation and follow onsemi's recommended ESD protection procedures. Ensure the PCB design includes ESD protection components, such as TVS diodes or ESD arrays, to protect the MOSFET from electrostatic discharge.
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NVHL060N090SC1 Overview
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