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NVMFS5A140PLZT1G - onsemi

Description: Small Footprint (5 x 6 mm); Low RDS(on); AEC-Q101 qualified and PPAP capable; RoHS compliance; NVMFS5A140PLZWF: Wettable Flank Option

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NVMFS5A140PLZT1G Details

  • Manufacturer Part Number:

    NVMFS5A140PLZT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SO-8FL / DFN-5

  • Package Description:

    SO-8FL, DFN5, 6 PIN

  • Manufacturer Package Code:

    488AA

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Date Of Intro:

    2017-02-15

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    420 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    140 A

  • Drain-source On Resistance-Max:

    7.2 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    720 pF

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    3.8 W

  • Power Dissipation-Max (Abs):

    200 W

  • Pulsed Drain Current-Max (IDM):

    560 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NVMFS5A140PLZT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the thermal pad of the NVMFS5A140PLZT1G to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation across the full temperature range, it is recommended to follow the recommended operating conditions, including voltage and current limits, and to ensure proper thermal management. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink or PCB.
  • The power-on reset (POR) timing of the NVMFS5A140PLZT1G can affect the system design, particularly in systems that require a specific power-up sequence. It is essential to consider the POR timing when designing the power-up sequence and reset circuitry to ensure proper system operation.
  • The NVMFS5A140PLZT1G has built-in current limiting and overcurrent protection features. To handle these features, it is recommended to follow the guidelines in the datasheet for setting the current limit and to ensure that the system design can handle the device's fault response, such as limiting the output current or shutting down the device in case of an overcurrent event.
  • To ensure EMI and ESD protection in the system design, it is recommended to follow proper PCB layout and design guidelines, such as using a solid ground plane, minimizing trace lengths, and using EMI filters and ESD protection devices as needed. Additionally, consider using a shielded enclosure and ensuring that the system meets the relevant EMI and ESD standards.

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NVMFS5A140PLZT1G Overview

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