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NVR5124PLT1G - onsemi

Description: Trench Technology; AECQ101 Qualified and PPAP Capable; RoHS Compliant

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PCB Footprints
NVR5124PLT1G - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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3D Models
NVR5124PLT1G - onsemi  - 3D model - SO Transistor Flat Lead - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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NVR5124PLT1G Details

  • Manufacturer Part Number:

    NVR5124PLT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P

  • Package Description:

    SOT-23, 3 PIN

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2016-05-26

  • Manufacturer:

    onsemi

  • YTEOL:

    6.9

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    1.1 A

  • Drain-source On Resistance-Max:

    0.365 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.47 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVR5124PLT1G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material to improve heat transfer.
  • Use a multi-layer PCB with a solid ground plane, and ensure that high-frequency signals are routed away from sensitive analog circuits. Also, consider using EMI filters or shielding to reduce radiation.
  • Use the device's power-saving modes, such as shutdown or standby, when not in use. Also, optimize the system's power supply voltage and reduce unnecessary current consumption in the system.
  • Use a 4-wire Kelvin connection for accurate voltage and current measurements. Also, use a high-impedance probe to minimize loading effects on the device under test.

Trust Checks

This model has been built in collaboration with the manufacturer.
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NVR5124PLT1G Overview

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