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NVTR01P02LT1G - onsemi

Description: Low RDS(on) Provides Higher Efficiency and Extends Battery Life; Miniature SOT-23 Surface Mount Package Saves Board Space; AEC-Q101 Qualified and PPAP capable

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PCB Footprints
NVTR01P02LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT−23 (TO−236) 2.90x1.30x1.00 1.90P CASE 318 ISSUE AU
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3D Models
NVTR01P02LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT−23 (TO−236) 2.90x1.30x1.00 1.90P CASE 318 ISSUE AU
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NVTR01P02LT1G Details

  • Manufacturer Part Number:

    NVTR01P02LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    1.3 A

  • Drain-source On Resistance-Max:

    0.22 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.4 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NVTR01P02LT1G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NVTR01P02LT1G involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the decoupling capacitors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • The NVTR01P02LT1G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. It's recommended to use an ESD wrist strap or mat, and to handle the devices by the body or leads, rather than the pins.
  • Yes, the NVTR01P02LT1G is suitable for high-frequency applications up to 1 GHz. However, it's essential to follow proper PCB layout and routing guidelines to minimize signal loss and ensure signal integrity.
  • To troubleshoot issues with the NVTR01P02LT1G, start by verifying the power supply voltage and ensuring that it's within the recommended operating range. Check for proper PCB layout and routing, and verify that the device is properly soldered and seated. Use oscilloscopes or logic analyzers to debug signal integrity issues.

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NVTR01P02LT1G Overview

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