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NX18P3001UKZ - NXP

Description: Power Switch ICs - Power Distribution Bidirectional power switch

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Symbol
NX18P3001UKZ - NXP - PCB symbol
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PCB Footprints
NX18P3001UKZ - NXP PCB footprint - BGA - BGA - WLCSP12_2020
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3D Models
NX18P3001UKZ - NXP - 3D model - BGA - WLCSP12_2020
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NX18P3001UKZ Details

  • Manufacturer Part Number:

    NX18P3001UKZ

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    WLCSP-12

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-XBGA-B12

  • Length:

    1.66 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA12,3X4,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max (Vsup):

    30 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    4 V

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +3.2V

  • Width:

    1.36 mm

NX18P3001UKZ Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink. The datasheet provides some guidelines, but a more detailed application note is available on the NXP website.
  • In addition to following the recommended PCB layout, ensure that the device is properly heatsinked, and consider using thermal interface materials. Also, ensure that the device is operated within the specified temperature range.
  • The current limit of the NX18P3001UKZ affects the maximum power handling capability of your system. Ensure that your system design takes into account the device's current limit to avoid overheating or damage.
  • Check the device's thermal design, ensure proper heatsinking, and verify that the device is operated within the specified temperature range. Also, check for any signs of overheating, such as reduced performance or shutdowns.
  • The device has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly. Ensure that your manufacturing process includes ESD protection measures, such as using ESD-safe materials and equipment.

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NX18P3001UKZ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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