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NX5P2924DUKZ - NXP

Description: Power Switch ICs - Power Distribution Logic-Controlled High-Side Power Switch

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PCB Footprints
NX5P2924DUKZ - NXP PCB footprint - BGA - BGA - WLCSP 1.39X0.89X0.465 PKG 0.5 PITCH -2025
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3D Models
NX5P2924DUKZ - NXP  - 3D model - BGA - WLCSP 1.39X0.89X0.465 PKG 0.5 PITCH -2025
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NX5P2924DUKZ Details

  • Manufacturer Part Number:

    NX5P2924DUKZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-XBGA-B6

  • Length:

    1.39 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max (Isup):

    0.11 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    0.8 V

  • Supply Voltage-Nom (Vsup):

    1 V

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.89 mm

NX5P2924DUKZ Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for this device. Ensure a solid ground plane, keep the input and output traces short and separate, and use a common mode filter to reduce EMI. Refer to the NXP application note AN11535 for more details.
  • The NX5P2924DUKZ is a highly configurable device. Use the NXP PCF85063A demo board and the accompanying software to configure the device for your specific application. You can also refer to the device's programming guide and the NXP support website for more information.
  • The NX5P2924DUKZ has an operating temperature range of -40°C to +125°C. However, the device's performance may degrade at extreme temperatures. Ensure proper thermal management and follow the recommended operating conditions for optimal performance.
  • For troubleshooting, refer to the NXP troubleshooting guide and the device's datasheet. Check for proper power supply, clock signal, and configuration. Use a logic analyzer or oscilloscope to debug the device's behavior. You can also contact NXP support for further assistance.
  • The NX5P2924DUKZ is a versatile device that can be used with a wide range of microcontrollers and processors. Check the device's datasheet and the microcontroller's datasheet to ensure compatibility. You can also refer to NXP's application notes and design guides for more information.

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NX5P2924DUKZ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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