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NXH600N65L4Q2F2SG - onsemi

Description: Power Integrated Module (PIM), I-Type NPC 650 V, 600 A IGBT, 650 V, 300 A Diode

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PCB Footprints
NXH600N65L4Q2F2SG - onsemi PCB footprint - Other - Other - PIM41, 93x47 (SOLDER PIN) CASE 180BC ISSUE O_2025
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3D Models
NXH600N65L4Q2F2SG - onsemi  - 3D model - Other - PIM41, 93x47 (SOLDER PIN) CASE 180BC ISSUE O_2025
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NXH600N65L4Q2F2SG Details

  • Manufacturer Part Number:

    NXH600N65L4Q2F2SG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PIM41, 93x47 (SOLDER PIN)

  • Manufacturer Package Code:

    180BC

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    483 A

  • Collector-Emitter Voltage-Max:

    650 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

  • Gate-Emitter Thr Voltage-Max:

    5.2 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-XUFM-X41

  • JESD-609 Code:

    e3

  • Number of Elements:

    4

  • Number of Terminals:

    41

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    931 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    732.05 ns

  • Turn-on Time-Nom (ton):

    199.45 ns

  • VCEsat-Max:

    2.2 V

NXH600N65L4Q2F2SG Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the NXH600N65L4Q2F2SG is -55°C to 150°C, as specified in the datasheet.
  • To ensure safe operating area, follow the guidelines in the datasheet, including limiting the drain-source voltage, drain current, and power dissipation. Additionally, consider the thermal management and heat sink design to prevent overheating.
  • The recommended gate drive voltage for the NXH600N65L4Q2F2SG is between 10V and 15V, as specified in the datasheet. However, the optimal gate drive voltage may vary depending on the specific application and switching frequency.
  • To handle the high peak current capability of the NXH600N65L4Q2F2SG, ensure that the PCB design and layout can handle the high current density. Use thick copper traces, and consider using multiple layers or a dedicated current path to minimize resistance and inductance.
  • The NXH600N65L4Q2F2SG has an ESD rating of HBM 2kV and CDM 1kV. To prevent ESD damage, handle the device with ESD-protected equipment, wear an ESD strap, and follow proper handling and storage procedures.

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NXH600N65L4Q2F2SG Overview

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