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NXQ1TXH5/101J - NXP

Description: Wireless Charging ICs NXQ1TXH5/101

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PCB Footprints
NXQ1TXH5/101J - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN32
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3D Models
NXQ1TXH5/101J - NXP  - 3D model - Quad Flat No-Lead - HVQFN32
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NXQ1TXH5/101J Details

  • Manufacturer Part Number:

    NXQ1TXH5/101J

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    HVQFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    SOT617-3

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2016-03-04

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    SEATED HGT-NOM

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    S-PQCC-N32

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.85 mm

  • Supply Current-Max (Isup):

    5000 mA

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    3.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

NXQ1TXH5/101J Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the layout symmetrical and avoid vias under the device. Use a 50-ohm microstrip transmission line for the RF output.
  • Use a thermal pad or a heat sink to maintain a junction temperature below 125°C. Ensure good airflow and avoid blocking the thermal pad. Follow the recommended operating conditions and derating guidelines.
  • Monitor the output power, frequency, and harmonics during production testing. Verify the device's performance across the specified temperature range and ensure compliance with regulatory requirements.
  • Consult the application note and reference design for guidance on optimizing the device's performance. Consider factors like PCB layout, component selection, and tuning for optimal performance.
  • Use high-quality, low-ESR capacitors and inductors that meet the recommended specifications. Ensure the components are rated for the operating frequency and power levels.

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NXQ1TXH5/101J Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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