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OMAPL137DZKB4 - Texas Instruments

Description: C6747 DSP+Arm Processor

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PCB Footprints
OMAPL137DZKB4 - Texas Instruments PCB footprint - BGA - BGA - ZKB (S-PBGA-N256)
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OMAPL137DZKB4 - Texas Instruments  - 3D model - BGA - ZKB (S-PBGA-N256)
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OMAPL137DZKB4 Details

  • Manufacturer Part Number:

    OMAPL137DZKB4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.75

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Address Bus Width:

    15

  • Barrel Shifter:

    NO

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    30 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    SINGLE

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    40

  • Number of Terminals:

    256

  • Number of Timers:

    3

  • On Chip Data RAM Width:

    8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    499712

  • Seated Height-Max:

    2.05 mm

  • Speed:

    456 MHz

  • Supply Voltage-Max:

    1.35 V

  • Supply Voltage-Min:

    1.25 V

  • Supply Voltage-Nom:

    1.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

OMAPL137DZKB4 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the core voltage (VDD) first, followed by the input/output voltage (VDDIO). This ensures that the internal voltage regulators are properly enabled before the I/Os are powered up.
  • The clock domains on OMAPL137DZKB4 can be configured using the Clock Domain Control (CDC) module. The CDC module allows you to configure the clock sources, dividers, and multiplexers to generate the required clock frequencies for the different domains.
  • The maximum operating frequency of the ARM926EJ-S core on OMAPL137DZKB4 is 300 MHz. However, the actual operating frequency may vary depending on the specific application and the clock configuration.
  • The External Memory Interface (EMIF) on OMAPL137DZKB4 can be used to interface with external memory devices such as SDRAM, NOR flash, and NAND flash. The EMIF is configured using the EMIF Control Module (ECM) and the External Memory Configuration (EMC) registers.
  • The Reset Control Module (RCM) on OMAPL137DZKB4 is responsible for generating and managing the reset signals for the device. The RCM can be used to generate a reset signal in response to a watchdog timer expiration, a brown-out detection, or a manual reset request.

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OMAPL137DZKB4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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