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OMAPL137DZKBD4 - Texas Instruments

Description: C6747 DSP+Arm Processor

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PCB Footprints
OMAPL137DZKBD4 - Texas Instruments PCB footprint - BGA - BGA - ZKB (S-PBGA-N256)
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OMAPL137DZKBD4 - Texas Instruments  - 3D model - BGA - ZKB (S-PBGA-N256)
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OMAPL137DZKBD4 Details

  • Manufacturer Part Number:

    OMAPL137DZKBD4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.75

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Address Bus Width:

    15

  • Barrel Shifter:

    NO

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    30 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    SINGLE

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    40

  • Number of Terminals:

    256

  • Number of Timers:

    3

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    90 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    499712

  • Seated Height-Max:

    2.05 mm

  • Speed:

    456 MHz

  • Supply Voltage-Max:

    1.35 V

  • Supply Voltage-Min:

    1.25 V

  • Supply Voltage-Nom:

    1.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

OMAPL137DZKBD4 Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the core voltage (VDD) first, followed by the input/output voltage (VDDIO). This ensures that the internal voltage regulators are powered up correctly.
  • The clock domains on OMAPL137DZKBD4 can be configured using the Clock Domain Control (CDC) module. The CDC module allows you to configure the clock sources, dividers, and multiplexers to generate the required clock signals for the device.
  • The maximum operating frequency of OMAPL137DZKBD4 is 456 MHz. However, the actual operating frequency may vary depending on the specific application and the clock configuration.
  • The External Memory Interface (EMIF) on OMAPL137DZKBD4 can be used to interface with external memory devices such as SDRAM, NOR flash, and NAND flash. The EMIF is configured using the EMIF Control Module (ECM) and the External Memory Interface (EMI) registers.
  • The Reset Control Module (RCM) on OMAPL137DZKBD4 is responsible for generating and controlling the reset signals for the device. The RCM can be used to reset the device, as well as to control the reset signals for external peripherals.

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OMAPL137DZKBD4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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