OMAPL138BZWT3 - Texas Instruments

OMAPL138BZWT3 Details

• Manufacturer Part Number:

  OMAPL138BZWT3

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Package Description:

  16 X 16 MM, 0.80 MM PITCH, GREEN, PLASTIC, NFBGA-361

• Pin Count:

  361

• HTS Code:

  8542.31.00.30

• Manufacturer:

  Texas Instruments

• YTEOL:

  0

• Additional Feature:

  ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY

• JESD-30 Code:

  S-PBGA-B361

• JESD-609 Code:

  e1

• Length:

  16 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  361

• Operating Temperature-Max:

  90 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA361,19X19,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.4 mm

• Supply Voltage-Max:

  1.35 V

• Supply Voltage-Min:

  0.95 V

• Supply Voltage-Nom:

  1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  OTHER

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  16 mm

• uPs/uCs/Peripheral ICs Type:

  SoC