OMAPL138EZWTA3E - Texas Instruments

OMAPL138EZWTA3E Details

• Manufacturer Part Number:

  OMAPL138EZWTA3E

• Brand Name:

  Texas Instruments

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  BGA

• Pin Count:

  361

• Country Of Origin:

  Philippines

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.75

• Manufacturer:

  Texas Instruments

• YTEOL:

  15

• Additional Feature:

  ALSO OPEARTES AT 1.1V, 1.2V AND 1.3V SUPLLY

• Address Bus Width:

  23

• Barrel Shifter:

  NO

• Bit Size:

  32

• Boundary Scan:

  YES

• Clock Frequency-Max:

  50 MHz

• External Data Bus Width:

  16

• Format:

  FLOATING POINT

• Integrated Cache:

  YES

• Internal Bus Architecture:

  MULTIPLE

• JESD-30 Code:

  S-PBGA-B361

• JESD-609 Code:

  e1

• Length:

  16 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of DMA Channels:

  64

• Number of Serial I/Os:

  3

• Number of Terminals:

  361

• Number of Timers:

  4

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA361,19X19,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• RAM (words):

  499712

• ROM Programmability:

  FLASH

• Seated Height-Max:

  1.4 mm

• Supply Voltage-Max:

  1.05 V

• Supply Voltage-Min:

  0.95 V

• Supply Voltage-Nom:

  1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  16 mm

• uPs/uCs/Peripheral ICs Type:

  SoC