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ONET1131ECRSMR - Texas Instruments

Description: Externally Modulated Laser Driver With Integrated Clock and Data Recovery (CDR)

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PCB Footprints
ONET1131ECRSMR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RSM0032B
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3D Models
ONET1131ECRSMR - Texas Instruments  - 3D model - Quad Flat No-Lead - RSM0032B
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ONET1131ECRSMR Details

  • Manufacturer Part Number:

    ONET1131ECRSMR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2016-09-04

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Applications:

    SONET

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.16SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    200 mA

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ATM/SONET/SDH TRANSCEIVER

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ONET1131ECRSMR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal management guide in their application note SLUAAT96, which includes guidelines for thermal pad connection, PCB layer stackup, and heat sink design.
  • The ONET1131ECRSMR has multiple power modes, including low-power modes. To configure the device for optimal power consumption, refer to the device's power management section in the datasheet and application notes. Additionally, consider using the TI Power Estimation Tool to estimate power consumption based on your specific use case.
  • To ensure EMI and EMC compliance, follow the guidelines in the TI application note SLAA644, which provides recommendations for PCB layout, component selection, and shielding. Additionally, consider using TI's EMC simulation tools to simulate and optimize your design.
  • The ONET1131ECRSMR supports secure boot and firmware updates through its ROM bootloader and cryptographic accelerators. Refer to the device's security documentation and TI's Secure Boot and Firmware Update guides for implementation details.
  • The internal oscillators have limitations in terms of frequency accuracy, stability, and jitter. For critical applications, consider using an external oscillator or crystal to ensure better performance. Refer to the device's datasheet and application notes for more information on internal oscillator characteristics and usage guidelines.

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ONET1131ECRSMR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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