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ONET4201LDRGER - Texas Instruments

Description: 155-Mbps to 4.25-Gbps laser driver with active back termination

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ONET4201LDRGER - Texas Instruments - PCB symbol
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PCB Footprints
ONET4201LDRGER - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGE0024B
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3D Models
ONET4201LDRGER - Texas Instruments - 3D model - Quad Flat No-Lead - RGE0024B
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ONET4201LDRGER Details

  • Manufacturer Part Number:

    ONET4201LDRGER

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Pin Count:

    24

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    S-PQCC-N24

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ONET4201LDRGER Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the center of the board, and the input and output tracks should be kept short and away from noise sources.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) as close to the device as possible. Add additional decoupling capacitors (e.g., 100nF) near the device's power pins. Ensure the power supply is stable and has low ripple.
  • The device is rated for operation from -40°C to 125°C. However, the maximum junction temperature (TJ) should not exceed 150°C. Ensure proper thermal design and heat sinking to maintain a safe operating temperature.
  • Check the power supply and decoupling, ensure proper PCB layout and routing, and verify correct pin connections. Use an oscilloscope to monitor the device's output and input signals. Consult the datasheet and application notes for troubleshooting guides.
  • Yes, but ensure you follow Texas Instruments' guidelines for high-reliability and safety-critical designs. Implement proper fault detection and correction mechanisms, and consider using redundant systems or fail-safes where necessary.

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ONET4201LDRGER Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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