Part Image

OPA180QDGKRQ1 - Texas Instruments

Description: Automotive-Qualified 0.1μV/°C Drift, Low-Noise, RRO, 36V, Zero-Drift Op Amp

Download OPA180QDGKRQ1 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
OPA180QDGKRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
click to zoom
3D Models
OPA180QDGKRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
click to zoom

OPA180QDGKRQ1 Details

  • Manufacturer Part Number:

    OPA180QDGKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2017-05-20

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0017 µA

  • Bias Current-Max (IIB) @25C:

    0.0017 µA

  • Common-mode Reject Ratio-Min:

    104 dB

  • Common-mode Reject Ratio-Nom:

    114 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0034 µA

  • Input Offset Voltage-Max:

    75 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    YES

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.8 V/us

  • Supply Current-Max:

    0.525 mA

  • Supply Voltage Limit-Max:

    20 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    158489.319

  • Wideband:

    NO

  • Width:

    3 mm

OPA180QDGKRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, which includes guidelines for component placement, trace routing, and thermal management. Additionally, TI offers a PCB layout checklist and a thermal design guide to help ensure optimal performance.
  • The OPA180QDGKRQ1 has built-in ESD protection, but it's still important to follow proper handling and storage procedures to prevent damage. Use an anti-static wrist strap or mat, and avoid touching the device pins. For added protection, consider using ESD-protection devices, such as TVS diodes, in your circuit design.
  • The maximum power dissipation for the OPA180QDGKRQ1 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C. However, it's essential to perform thermal analysis and consider heat sinking or other thermal management techniques to ensure the device operates within safe limits.
  • The OPA180QDGKRQ1 is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at higher temperatures. It's crucial to evaluate the device's performance and consider derating the power supply voltage and current at elevated temperatures. Additionally, ensure that the device is properly heat-sinked and that the PCB design takes into account thermal expansion and contraction.
  • The output capacitor selection depends on the specific application requirements, such as the desired bandwidth, noise tolerance, and output impedance. As a general guideline, use a low-ESR capacitor with a value between 10nF to 100nF. The datasheet provides more detailed guidance on output capacitor selection and layout considerations.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

OPA180QDGKRQ1 Overview

Use the download button to access the OPA180QDGKRQ1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like OPA18, or try a keyword search, such as Operational Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to OPA180QDGKRQ1

Showing 0 results