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OPA2170AIDCUR - Texas Instruments

Description: 36V, microPower, Rail-to-Rail Output, Dual, General Purpose Op Amp in microPackage

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OPA2170AIDCUR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DCU (R-PDSO-G8)
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OPA2170AIDCUR - Texas Instruments  - 3D model - Small Outline Packages - DCU (R-PDSO-G8)
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OPA2170AIDCUR Details

  • Manufacturer Part Number:

    OPA2170AIDCUR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0035 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    104 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0035 µA

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -18 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    0.29 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    18 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Min:

    316000

  • Wideband:

    NO

  • Width:

    2 mm

OPA2170AIDCUR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA2170AIDCUR is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability in a unity-gain configuration, it's recommended to add a capacitor (typically 10-22pF) between the output and the inverting input to compensate for the op-amp's internal capacitance and ensure stability.
  • To minimize noise and EMI, it's recommended to keep the input and output traces short and away from each other, use a ground plane, and avoid running signal traces near the op-amp's power pins. Additionally, decoupling capacitors should be placed close to the op-amp's power pins.
  • The OPA2170AIDCUR is rated for operation up to 125°C, but its performance may degrade at higher temperatures. If you need to operate the op-amp in a high-temperature environment, you should consult the datasheet and application notes for guidance on thermal management and derating.
  • When choosing resistors for the feedback network, consider the op-amp's input impedance, output impedance, and desired gain. Use resistors with a low temperature coefficient (TCR) and a high power rating to minimize thermal noise and ensure stability.

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OPA2170AIDCUR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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