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OPA2171AIDR - Texas Instruments

Description: 36V, Low Power, RRO, General Purpose Operational Amplifier in MicroPackages SOIC

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OPA2171AIDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin SOIC-ren5
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OPA2171AIDR - Texas Instruments  - 3D model - Small Outline Packages - 8-Pin SOIC-ren5
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OPA2171AIDR Details

  • Manufacturer Part Number:

    OPA2171AIDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0035 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    104 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0035 µA

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -18 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1.5 V/us

  • Supply Current-Max:

    1.19 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    18 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    316000

  • Wideband:

    NO

  • Width:

    3.9 mm

OPA2171AIDR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of OPA2171AIDR is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper PCB layout practices, such as minimizing parasitic capacitance and inductance, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, selecting the correct gain and bandwidth for your application can help prevent oscillations.
  • The recommended input capacitance is 10nF to 100nF, and the recommended output capacitance is 10nF to 1μF. However, the optimal capacitance values may vary depending on the specific application and frequency range.
  • While OPA2171AIDR is rated for operation up to 125°C, it's essential to consider the device's thermal limitations and ensure proper heat sinking and cooling in high-temperature environments. Consult the datasheet and application notes for guidance on thermal management.
  • To reduce noise and EMI, use proper shielding, grounding, and layout techniques. Additionally, consider using filters, such as RC filters or ferrite beads, to attenuate high-frequency noise and EMI.

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OPA2171AIDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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