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OPA2171MDCUTEP - Texas Instruments

Description: 36-V, Single-Supply, SOT553, General-Purpose Operational Amplifiers

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OPA2171MDCUTEP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DCU (R-PDSO-G8)
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OPA2171MDCUTEP - Texas Instruments  - 3D model - Small Outline Packages - DCU (R-PDSO-G8)
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OPA2171MDCUTEP Details

  • Manufacturer Part Number:

    OPA2171MDCUTEP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000015 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    87 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.004 µA

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    0.9 mm

  • Slew Rate-Nom:

    1.5 V/us

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage Limit-Max:

    36 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    316227.766

  • Wideband:

    NO

  • Width:

    2 mm

OPA2171MDCUTEP Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA2171MDCUTEP involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • The choice of gain resistors depends on the desired gain, input impedance, and noise requirements. A good starting point is to use the gain resistor calculator tool provided by Texas Instruments or to consult the application notes for guidance.
  • The maximum power dissipation of OPA2171MDCUTEP is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the actual operating conditions.
  • OPA2171MDCUTEP is specified to operate from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to consult the datasheet and application notes for guidance on using the device in high-temperature environments.
  • To filter out noise and interference, use a combination of passive and active filtering techniques. Add bypass capacitors to the power supply lines, use a low-pass filter at the input, and consider adding a noise filter stage before the amplifier. Additionally, use shielding and grounding techniques to minimize electromagnetic interference.

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OPA2171MDCUTEP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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