Part Image

OPA2196IDGKR - Texas Instruments

Description: 36V, Low Power, All-Purpose Amplifier with MUX-Friendly Input

Download OPA2196IDGKR Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
OPA2196IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
click to zoom
3D Models
OPA2196IDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
click to zoom

OPA2196IDGKR Details

  • Manufacturer Part Number:

    OPA2196IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2017-07-17

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001999 µA

  • Bias Current-Max (IIB) @25C:

    0.00002 µA

  • Common-mode Reject Ratio-Min:

    120 dB

  • Common-mode Reject Ratio-Nom:

    140 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    100 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -3 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    5.5 V/us

  • Supply Current-Max:

    0.4 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2500

  • Voltage Gain-Min:

    316227.7

  • Wideband:

    NO

  • Width:

    3 mm

OPA2196IDGKR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA2196IDGKR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet.
  • The choice of gain resistors depends on the desired gain and bandwidth. TI provides a gain resistor calculator tool to help with the selection. Additionally, the datasheet provides guidelines for selecting gain resistors based on the desired gain and bandwidth.
  • The maximum power dissipation of OPA2196IDGKR is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this can be derated based on the thermal resistance of the package and the ambient temperature.
  • OPA2196IDGKR is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the device's thermal characteristics and ensure proper heat sinking and thermal management in high-temperature applications.
  • To ensure EMC with OPA2196IDGKR, follow proper PCB layout and design practices, such as using a solid ground plane, minimizing loop areas, and using shielding and filtering techniques. Additionally, ensure that the device is properly decoupled and that the power supply is well-regulated.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

OPA2196IDGKR Overview

Use the download button to access the OPA2196IDGKR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like OPA21, or try a keyword search, such as Operational Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to OPA2196IDGKR

Showing 0 results