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OPA2301AIDGKR - Texas Instruments

Description: High Speed Operational Amplifiers Lo-Noise High-Speed 16-Bit Accurate CMOS

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OPA2301AIDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2301AIDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2301AIDGKR Details

  • Manufacturer Part Number:

    OPA2301AIDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000005 µA

  • Bias Current-Max (IIB) @25C:

    0.000005 µA

  • Common-mode Reject Ratio-Min:

    66 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000005 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    80 V/us

  • Supply Current-Max:

    24 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    150000

  • Voltage Gain-Min:

    31622.776

  • Wideband:

    NO

  • Width:

    3 mm

OPA2301AIDGKR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, which includes guidelines for component placement, trace routing, and decoupling capacitors. Additionally, TI recommends following good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding noise sources near the op-amp.
  • The OPA2301AIDGKR requires a 0.1uF to 1uF decoupling capacitor between the power supply pins (V+ and V-) and ground. The capacitor should be placed as close as possible to the op-amp, and its value should be chosen based on the specific application's noise requirements and power supply characteristics.
  • The maximum power dissipation of the OPA2301AIDGKR is dependent on the ambient temperature and the package type. For the DGV package, the maximum power dissipation is 440mW at 25°C. However, this value can be derated based on the ambient temperature, and it's recommended to consult the datasheet for more information.
  • The OPA2301AIDGKR is specified to operate from -40°C to 125°C, but its performance may degrade at higher temperatures. It's recommended to consult the datasheet for temperature-related specifications and to consider using a thermally-enhanced package or a different op-amp if high-temperature operation is required.
  • To ensure EMC with the OPA2301AIDGKR, it's recommended to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding noise sources near the op-amp. Additionally, shielding, filtering, and grounding techniques can be used to reduce electromagnetic interference (EMI).

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OPA2301AIDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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