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OPA2310IDGKR - Texas Instruments

Description: General Purpose Amplifier 2 Circuit Push-Pull, Rail-to-Rail 8-VSSOP

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PCB Footprints
OPA2310IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK0008A
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OPA2310IDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK0008A
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OPA2310IDGKR Details

  • Manufacturer Part Number:

    OPA2310IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00003 µA

  • Bias Current-Max (IIB) @25C:

    0.00003 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1300 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    3 V/us

  • Supply Current-Max:

    0.43 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    31622.7766

  • Wideband:

    NO

  • Width:

    3 mm

OPA2310IDGKR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, which includes guidelines for component placement, trace routing, and grounding. Additionally, it's essential to follow good PCB design practices, such as minimizing noise coupling, using a solid ground plane, and keeping signal traces short and direct.
  • The gain resistors (Rf and Rg) should be chosen based on the desired gain and bandwidth of the amplifier. A higher gain requires smaller resistors, while a lower gain requires larger resistors. The datasheet provides a gain resistor calculation formula and a table with recommended resistor values for different gains.
  • The maximum power dissipation of the OPA2310IDGKR is dependent on the ambient temperature and the package type. For the DGK package, the maximum power dissipation is 1.4W at 25°C. However, it's essential to calculate the power dissipation based on the specific application and ensure that it does not exceed the maximum rating.
  • Yes, the OPA2310IDGKR can be used as a unity-gain buffer by connecting the output directly to the inverting input (i.e., Rf = 0Ω and Rg = ∞Ω). However, it's essential to ensure that the input impedance is high enough to avoid loading the input signal.
  • The OPA2310IDGKR has built-in ESD protection, but it's still essential to follow proper ESD handling procedures when handling the device. This includes using an ESD wrist strap, ESD mat, or ESD bag, and avoiding direct contact with the device pins.

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OPA2310IDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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