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OPA2313IDRGR - Texas Instruments

Description: Op Amp Dual Low Noise Amplifier R-R I/O ±2.75V/5.5V 8-Pin WSON EP T/R

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PCB Footprints
OPA2313IDRGR - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - DRG (S-PWSON-N8)
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3D Models
OPA2313IDRGR - Texas Instruments  - 3D model - Small Outline No-lead - DRG (S-PWSON-N8)
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OPA2313IDRGR Details

  • Manufacturer Part Number:

    OPA2313IDRGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SON

  • Pin Count:

    8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0006 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    64 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.11,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Nom:

    0.5 V/us

  • Supply Current-Max:

    0.12 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    31620

  • Wideband:

    NO

  • Width:

    3 mm

OPA2313IDRGR Frequently Asked Questions (FAQs)

  • A good PCB layout for the OPA2313IDRGR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet.
  • The choice of gain resistors depends on the desired gain, input impedance, and output impedance. TI provides a gain resistor calculator tool to help with the selection. Additionally, the datasheet provides guidelines for selecting gain resistors.
  • The maximum power dissipation of the OPA2313IDRGR is dependent on the ambient temperature and the thermal resistance of the package. The datasheet provides a power dissipation calculation formula and a thermal resistance value to help determine the maximum power dissipation.
  • Yes, the OPA2313IDRGR can be used as a unity-gain buffer by connecting the output to the inverting input and using a gain resistor ratio of 1:1. However, this configuration may not provide the best noise performance.
  • To filter out noise and oscillations, use a capacitor in series with the gain resistors, and/or add a capacitor in parallel with the output. Additionally, ensure that the PCB layout is well-designed and that the power supply is well-regulated.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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