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OPA2313QDGKRQ1 - Texas Instruments

Description: 1 MHz, micropower, low-noise, rail-to-rail I/O op amp

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OPA2313QDGKRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2313QDGKRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2313QDGKRQ1 Details

  • Manufacturer Part Number:

    OPA2313QDGKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2018-12-06

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0006 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    64 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.5 V/us

  • Supply Current-Max:

    0.12 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    158489.31

  • Wideband:

    NO

  • Width:

    3 mm

OPA2313QDGKRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the OPA2313 datasheet, which includes guidelines for component placement, trace routing, and grounding. Additionally, TI recommends using a 4-layer PCB with a solid ground plane to minimize noise and EMI.
  • For single-supply operation, the OPA2313QDGKRQ1 requires a bias voltage between VCC and VEE. TI recommends using a voltage divider or a voltage reference to set the bias voltage to mid-supply (VCC/2). Additionally, ensure that the input common-mode voltage is within the recommended range.
  • The OPA2313QDGKRQ1 can drive capacitive loads up to 1nF without oscillation or instability. However, TI recommends using a series resistor (Rs) to limit the capacitive load and prevent oscillation. The value of Rs depends on the capacitive load and the desired frequency response.
  • To reduce noise and EMI, TI recommends using a low-noise power supply, decoupling capacitors, and a solid ground plane. Additionally, use shielding and guard rings to minimize electromagnetic interference. Ensure that the input and output traces are routed away from noise sources and digital signals.
  • The OPA2313QDGKRQ1 has a thermal derating of 13.9mW/°C above 25°C. This means that the maximum power dissipation decreases by 13.9mW for every degree Celsius above 25°C. Ensure that the device is properly heat-sinked and that the ambient temperature is within the recommended range.

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OPA2313QDGKRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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