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OPA2335AIDGKTG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps 0.05uV/C max Single-Supply CMOS

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OPA2335AIDGKTG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2335AIDGKTG4 - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2335AIDGKTG4 Details

  • Manufacturer Part Number:

    OPA2335AIDGKTG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CHOPPER-STAB

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    110 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0004 µA

  • Input Offset Voltage-Max:

    5 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1.6 V/us

  • Supply Current-Max:

    0.7 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    316000

  • Wideband:

    NO

  • Width:

    3 mm

OPA2335AIDGKTG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the OPA2335AIDGKTG4 datasheet, which includes guidelines for component placement, routing, and grounding. Additionally, TI recommends using a 4-layer PCB with a solid ground plane and a separate analog ground plane to minimize noise and ensure optimal performance.
  • The OPA2335AIDGKTG4 has built-in ESD protection, but it's still important to follow proper handling and storage procedures to prevent damage. Use an anti-static wrist strap or mat when handling the device, and store it in an anti-static bag or container. Additionally, consider adding external ESD protection devices, such as TVS diodes, to the PCB design.
  • The maximum power dissipation of OPA2335AIDGKTG4 is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 500mW at 25°C ambient temperature. However, this value can be derated based on the thermal resistance of the PCB and the operating temperature range.
  • The OPA2335AIDGKTG4 is specified to operate from -40°C to 125°C, but its performance may degrade at higher temperatures. TI recommends derating the device's power dissipation and ensuring proper thermal management to prevent overheating. Additionally, consider using a thermally-enhanced package or a heat sink to improve heat dissipation.
  • To ensure EMC with OPA2335AIDGKTG4, follow proper PCB design and layout guidelines, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components. Additionally, consider using a metal shield or a Faraday cage to enclose the device and reduce electromagnetic radiation.

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OPA2335AIDGKTG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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