Please enter a minimum 3 letters or numbers
Technical Content
Part Image

OPA2336P - Texas Instruments

Description: Texas Instruments OPA2336P, Dual Op Amp, 0.1MHz CMOS, Rail to Rail, 3 V, 5 V, 8-Pin PDIP

Download OPA2336P Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
OPA2336P - Texas Instruments - PCB symbol
click to zoom
PCB Footprints
OPA2336P - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - p(r-pdip-t8)
click to zoom
3D Models
OPA2336P - Texas Instruments - 3D model - Dual-In-Line Packages - p(r-pdip-t8)
click to zoom

OPA2336P Details

  • Manufacturer Part Number:

    OPA2336P

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    DIP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    125 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e4

  • Length:

    9.59 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Nom:

    0.03 V/us

  • Supply Current-Max:

    0.064 mA

  • Supply Voltage Limit-Max:

    7.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    100

  • Voltage Gain-Min:

    31600

  • Wideband:

    NO

  • Width:

    7.62 mm

OPA2336P Frequently Asked Questions (FAQs)

  • TI recommends a compact, symmetrical layout with the op-amp placed close to the signal sources and loads. Keep the input and output traces short and away from noise sources. Use a solid ground plane and decouple the power pins with 0.1uF capacitors.
  • Choose gain resistors based on the desired gain and bandwidth. Higher gain resistors reduce bandwidth, while lower gain resistors increase bandwidth. Use TI's online tools or consult the datasheet's gain-bandwidth product graph to determine the optimal resistor values for your application.
  • The OPA2336P can drive up to 1nF of capacitive load. Exceeding this limit can cause oscillations and instability. To ensure stability, add a series resistor (Rs) to the output, where Rs = 10-50 ohms, depending on the capacitive load.
  • Use voltage clamps or transient voltage suppressors (TVS) to protect the op-amp from overvoltage. For ESD protection, use a TVS or a series resistor with a capacitor to ground on the input pins. Follow proper PCB design and handling practices to prevent ESD damage.
  • The thermal impedance of the OPA2336P is 120°C/W. To ensure reliable operation, keep the junction temperature below 150°C. Use a heat sink or a thermally enhanced package, and follow proper thermal design practices to minimize power dissipation and thermal stress.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

OPA2336P Overview

Use the download button to access the OPA2336P schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like OPA23, or try a keyword search, such as Operational Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to OPA2336P

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑

OPA2336P Alternates

Showing results

Image Part Number Model
Part Image LMC6462AIN National Semiconductor Corporation

Operational Amplifier, 2 Func, 2000uV Offset-Max, CMOS, PDIP8
Part Image LMC6462AMN National Semiconductor Corporation

Operational Amplifier, 2 Func, 1500uV Offset-Max, CMOS, PDIP8
Part Image LMC6062AMN National Semiconductor Corporation

Operational Amplifier, 2 Func, 1200uV Offset-Max, CMOS, PDIP8
Part Image TLV2252CP Texas Instruments

Operational Amplifier, 2 Func, 1000uV Offset-Max, CMOS, PDIP8
Part Image LMC6572AIN Texas Instruments

Operational Amplifier, 2 Func, 3500uV Offset-Max, CMOS, PDIP8
For a full list of alternate parts for OPA2336P, check out Findchips.com