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OPA2353EA/250G4 - Texas Instruments

Description: High Speed Operational Amplifiers Hi-Spd Single-Sply Rail-to-Rail

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OPA2353EA/250G4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2353EA/250G4 - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2353EA/250G4 Details

  • Manufacturer Part Number:

    OPA2353EA/250G4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    76 dB

  • Common-mode Reject Ratio-Nom:

    86 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    8000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    22 V/us

  • Supply Current-Max:

    16 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    44000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3 mm

OPA2353EA/250G4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout that minimizes parasitic inductance and capacitance, keeps the input and output traces short and separate, and uses a solid ground plane to reduce noise and electromagnetic interference (EMI). A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, ensure that the circuit has a sufficient phase margin, and the gain-bandwidth product is not exceeded. Use a compensation capacitor (if required) and ensure that the output impedance is low enough to drive the load. Also, avoid using long input traces and keep the input and output traces separate to minimize parasitic capacitance.
  • The maximum power dissipation of OPA2353EA/250G4 is dependent on the ambient temperature and the thermal resistance of the package. The maximum power dissipation can be calculated using the formula: Pd = (TJ - TA) / θJA, where Pd is the power dissipation, TJ is the junction temperature, TA is the ambient temperature, and θJA is the thermal resistance. The maximum power dissipation is typically around 1.4W.
  • Yes, OPA2353EA/250G4 can be used in high-temperature environments, but the maximum junction temperature (TJ) should not exceed 150°C. The device's performance and reliability may degrade at high temperatures, and the maximum power dissipation should be derated accordingly. Consult the datasheet for more information on temperature-related specifications.
  • To protect OPA2353EA/250G4 from EMI and RFI, use a shielded enclosure, keep the input and output traces short and separate, and use a common-mode choke or ferrite bead to filter out high-frequency noise. Also, ensure that the PCB layout is designed to minimize radiation and susceptibility to external interference.

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OPA2353EA/250G4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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