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OPA2356MDGKTEP - Texas Instruments

Description: Enhanced Product 2.5V, 200MHz GBW, CMOS dual op amp

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OPA2356MDGKTEP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK
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OPA2356MDGKTEP - Texas Instruments  - 3D model - Small Outline Packages - DGK
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OPA2356MDGKTEP Details

  • Manufacturer Part Number:

    OPA2356MDGKTEP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2019-02-09

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    66 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    9000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    300 V/us

  • Supply Current-Max:

    28 mA

  • Supply Voltage Limit-Max:

    7.5 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    50000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

OPA2356MDGKTEP Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout that minimizes parasitic inductance and capacitance, keeps the input and output traces short and separate, and uses a solid ground plane. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, use a gain resistor (RG) that is less than or equal to 1 kΩ, and a feedback capacitor (CF) that is greater than or equal to 10 pF. Additionally, ensure that the phase margin is greater than 45° by using the TI's SPICE model or a simulation tool.
  • The maximum power dissipation of OPA2356MDGKTEP is 1.4 W. However, this can be limited by the thermal resistance of the package and the PCB. Ensure that the device is properly heat-sinked and the PCB is designed to dissipate heat efficiently.
  • Yes, OPA2356MDGKTEP is specified to operate from -40°C to 125°C. However, the device's performance may degrade at high temperatures, and the maximum junction temperature should not exceed 150°C. Ensure that the device is properly heat-sinked and the PCB is designed to dissipate heat efficiently.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Additionally, ensure that the PCB is designed with ESD protection in mind, including the use of ESD-safe handling and storage procedures.

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OPA2356MDGKTEP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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