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OPA2363IDGSR - Texas Instruments

Description: 1.8V, High CMR, RRIO Op Amp with Shutdown

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OPA2363IDGSR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS (S-PDSO-G10)
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3D Models
OPA2363IDGSR - Texas Instruments  - 3D model - Small Outline Packages - DGS (S-PDSO-G10)
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OPA2363IDGSR Details

  • Manufacturer Part Number:

    OPA2363IDGSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    5 V/us

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    7000

  • Voltage Gain-Min:

    19950

  • Wideband:

    NO

  • Width:

    3 mm

OPA2363IDGSR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA2363IDGSR is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability in a unity-gain configuration, it's recommended to add a 10nF to 22nF capacitor in parallel with a 1kΩ to 2kΩ resistor between the output and the inverting input. This helps to reduce the phase margin and prevent oscillations.
  • To minimize noise and EMI, it's recommended to keep the input and output traces as short as possible, use a ground plane, and avoid running sensitive traces near the power supply or other noisy signals. Additionally, decoupling capacitors should be placed as close to the device as possible.
  • While the OPA2363IDGSR can be used as a comparator, it's not the most suitable device for this application. The OPA2363IDGSR is an op-amp designed for linear applications, and its output stage is not optimized for high-speed switching. Texas Instruments recommends using a dedicated comparator device, such as the TLV7031, for comparator applications.
  • The OPA2363IDGSR has internal ESD protection, but it's still recommended to follow proper ESD handling procedures when handling the device. This includes using an ESD wrist strap, ESD mat, or ESD bag, and avoiding touching the device pins or leads.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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