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OPA2364ID - Texas Instruments

Description: Texas Instruments OPA2364ID, Dual Op Amp, 7MHz CMOS, Rail to Rail, 3 V, 5 V, 8-Pin SOIC

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OPA2364ID - Texas Instruments PCB footprint - Other - Other - SOIC127P600X175-8N
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OPA2364ID - Texas Instruments  - 3D model - Other - SOIC127P600X175-8N
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OPA2364ID Details

  • Manufacturer Part Number:

    OPA2364ID

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    5 V/us

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    7000

  • Voltage Gain-Min:

    19950

  • Wideband:

    NO

  • Width:

    3.9 mm

OPA2364ID Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground layout with a single-point ground connection to minimize noise and parasitic inductance. Additionally, keep the input and output traces short and away from each other to reduce capacitive coupling.
  • The OPA2364ID has internal ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an anti-static bag or tube.
  • The maximum power dissipation for the OPA2364ID is dependent on the ambient temperature and the thermal resistance of the package. For the SOIC package, the maximum power dissipation is approximately 1.4W at 25°C ambient temperature. Consult the datasheet for more information on thermal calculations.
  • Yes, the OPA2364ID can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance to prevent signal attenuation. Additionally, consider the output impedance and load capacitance to ensure stability.
  • Choose bypass capacitors with a low equivalent series resistance (ESR) and a high self-resonant frequency (SRF) to ensure effective noise filtering. A 10nF to 100nF ceramic capacitor is a good starting point, but the optimal value may vary depending on the specific application and PCB layout.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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