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OPA2376AID - Texas Instruments

Description: TEXAS INSTRUMENTS - OPA2376AID . - Operational Amplifier, Dual, 2 Amplifier, 5.5 MHz, 2 V/µs, 2.2V to 5.5V, SOIC, 8 Pins

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OPA2376AID - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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OPA2376AID - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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OPA2376AID Details

  • Manufacturer Part Number:

    OPA2376AID

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    76 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    2 V/us

  • Supply Current-Max:

    1.9 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    2.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5500

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    3.9 mm

OPA2376AID Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA2376AID is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • Yes, the OPA2376AID is rated for operation from -40°C to 125°C, making it suitable for high-temperature applications. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature should not exceed 150°C.
  • To ensure stability, it's essential to follow proper PCB layout practices, use a low-ESR capacitor for decoupling, and avoid capacitive loads. Additionally, the OPA2376AID has a phase margin of 60°, which helps to maintain stability in most applications.
  • For optimal performance, it's recommended to follow a star-ground layout, keep the input and output traces short and symmetrical, and avoid routing signals near the op-amp's inputs. Additionally, use a solid ground plane and decouple the power supplies with low-ESR capacitors.
  • While the OPA2376AID can be used as a comparator, it's not the most suitable device for this application. The OPA2376AID is an op-amp designed for linear applications, and its output stage is not optimized for high-speed switching. For comparator applications, a dedicated comparator IC like the LM339 or TLV7031 is recommended.

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OPA2376AID Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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