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OPA2725AIDGKR - Texas Instruments

Description: Operational Amplifiers - Op Amps Dual Very Lo-Noise Hi-Speed 12V CMOS

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OPA2725AIDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2725AIDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2725AIDGKR Details

  • Manufacturer Part Number:

    OPA2725AIDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    88 dB

  • Common-mode Reject Ratio-Nom:

    94 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00005 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.6 V

  • Neg Supply Voltage-Nom (Vsup):

    -6 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    30 V/us

  • Supply Current-Max:

    11 mA

  • Supply Voltage Limit-Max:

    6.6 V

  • Supply Voltage-Nom (Vsup):

    6 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    20000

  • Voltage Gain-Min:

    63100

  • Wideband:

    NO

  • Width:

    3 mm

OPA2725AIDGKR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the OPA2725A datasheet, which includes guidelines for component placement, trace routing, and grounding. Additionally, TI recommends using a 4-layer PCB with a solid ground plane and a separate analog ground plane to minimize noise and interference.
  • To ensure stability, follow the recommended compensation network and component values provided in the datasheet. Additionally, ensure that the circuit layout is well-designed, with minimal parasitic capacitance and inductance. TI also recommends using a low-ESR capacitor for power supply decoupling and avoiding long, unshielded input traces.
  • The maximum power dissipation of OPA2725AIDGKR is dependent on the ambient temperature and the thermal resistance of the package. TI provides a power dissipation calculator in the datasheet, which takes into account the operating conditions, package type, and ambient temperature. The calculator helps determine the maximum allowed power dissipation to prevent overheating and ensure reliable operation.
  • OPA2725AIDGKR is specified to operate from -40°C to 125°C. However, the device's performance and reliability may degrade at higher temperatures. TI recommends derating the power supply voltage and output current at high temperatures to prevent overheating and ensure reliable operation. Additionally, the device's offset voltage and noise performance may degrade at high temperatures.
  • To protect OPA2725AIDGKR from EMI and RFI, use a shielded enclosure, and ensure that the PCB layout is designed to minimize radiation and susceptibility. TI recommends using a common-mode choke or ferrite bead on the input traces, and placing a shielded capacitor between the input pins and ground. Additionally, use a low-pass filter or EMI filter on the power supply lines.

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OPA2725AIDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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