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OPA2734AIDGSR - Texas Instruments

Description: Operational Amplifiers - Op Amps 0.05uV/dgC Sngl-Sply CMOS 0-Drift Series

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OPA2734AIDGSR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A
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OPA2734AIDGSR - Texas Instruments  - 3D model - Small Outline Packages - DGS0010A
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OPA2734AIDGSR Details

  • Manufacturer Part Number:

    OPA2734AIDGSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    115 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0003 µA

  • Input Offset Voltage-Max:

    5 µV

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1.5 V/us

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage Limit-Max:

    6.6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1600

  • Voltage Gain-Min:

    562000

  • Wideband:

    NO

  • Width:

    3 mm

OPA2734AIDGSR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout that minimizes parasitic inductance and capacitance, keeps the input and output traces short and separate, and uses a solid ground plane. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, ensure that the gain is set to a value that does not exceed the recommended maximum gain, and that the feedback network is properly compensated. Additionally, use a capacitor in the feedback path to compensate for the op-amp's internal pole.
  • The maximum power dissipation of OPA2734AIDGSR is 670mW, which is calculated based on the maximum junction temperature (150°C) and the thermal resistance of the package (125°C/W).
  • Yes, OPA2734AIDGSR is rated for operation up to 125°C, but the maximum junction temperature should not exceed 150°C. Ensure that the device is properly heat-sinked and that the power dissipation is within the recommended limits.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins, and ensure that the PCB is designed with ESD protection in mind. Handle the device with ESD-safe equipment and follow proper handling procedures.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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