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OPA2734AIDGST - Texas Instruments

Description: Dual 0.05uV/degC (max) single-supply CMOS operational amplifier, zero-drift series with shutdown<

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OPA2734AIDGST - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A 2021
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OPA2734AIDGST - Texas Instruments  - 3D model - Small Outline Packages - DGS0010A 2021
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OPA2734AIDGST Details

  • Manufacturer Part Number:

    OPA2734AIDGST

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    115 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0003 µA

  • Input Offset Voltage-Max:

    5 µV

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1.5 V/us

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage Limit-Max:

    6.6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1600

  • Voltage Gain-Min:

    562000

  • Wideband:

    NO

  • Width:

    3 mm

OPA2734AIDGST Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA2734AIDGST is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • Yes, the OPA2734AIDGST is rated for operation from -40°C to 125°C, making it suitable for high-temperature applications. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature should not be exceeded.
  • To minimize noise and ensure optimal performance, it is recommended to follow good PCB layout practices, such as keeping the signal traces short and away from noise sources, using a solid ground plane, and decoupling the power supply with capacitors.
  • Yes, the OPA2734AIDGST can be used as a unity-gain buffer. The device has a high input impedance and a low output impedance, making it suitable for buffering applications. However, the gain bandwidth product should be considered to ensure stability.
  • The recommended capacitor value for decoupling the power supply of the OPA2734AIDGST is 0.1uF to 1uF, depending on the specific application and noise requirements. A larger capacitor value may be needed for high-frequency noise filtering.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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