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OPA2822E/250 - Texas Instruments

Description: Texas Instruments OPA2822E/250, Dual Low Noise Op Amp, 240MHz, 5 → 12 V, 8-Pin VSSOP

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OPA2822E/250 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2822E/250 - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2822E/250 Details

  • Manufacturer Part Number:

    OPA2822E/250

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    21 µA

  • Bias Current-Max (IIB) @25C:

    18 µA

  • Common-mode Reject Ratio-Min:

    85 dB

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.4 µA

  • Input Offset Voltage-Max:

    1200 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -6 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    80 V/us

  • Slew Rate-Nom:

    170 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    23.6 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    6 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    400000

  • Voltage Gain-Min:

    6300

  • Wideband:

    YES

  • Width:

    3 mm

OPA2822E/250 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA2822E/250 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the power pins. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, use a gain resistor (Rg) that is at least 10 times the value of the feedback resistor (Rf). Also, ensure that the capacitive load is limited to 10pF or less, and use a compensation capacitor (Cc) if necessary.
  • The maximum power dissipation of OPA2822E/250 is 670mW. However, this can be limited by the thermal resistance of the package and the ambient temperature. It's essential to calculate the power dissipation and ensure it's within the safe operating area.
  • Yes, OPA2822E/250 can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is high enough to avoid loading the input signal. A buffer configuration can also be used to improve the output drive capability.
  • To minimize EMI and RFI, use a shielded enclosure, keep the circuit layout compact, and use a common-mode choke or ferrite beads on the input and output lines. Also, ensure that the power supply is well-regulated and decoupled.

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OPA2822E/250 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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