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OPA313IDBVR - Texas Instruments

Description: 1-MHz, Micropower, Low-Noise, Rail-to-Rail I/O 1.8-V Operational Amplifier

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PCB Footprints
OPA313IDBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV
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3D Models
OPA313IDBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV
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OPA313IDBVR Details

  • Manufacturer Part Number:

    OPA313IDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0006 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    64 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.5 V/us

  • Supply Current-Max:

    0.06 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    31622.776

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA313IDBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA313IDBVR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • The choice of gain resistors depends on the desired gain and bandwidth. A good starting point is to use the gain resistor calculator tool provided by Texas Instruments or to consult the application notes. Typically, a ratio of 1:1 to 10:1 for Rf:Rg is recommended.
  • The maximum power dissipation of OPA313IDBVR is 750mW. However, this can be limited by the thermal resistance of the package and the ambient temperature. It's essential to calculate the power dissipation and ensure it's within the safe operating area.
  • Yes, OPA313IDBVR can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance to avoid signal attenuation. A buffer configuration can also help to improve the output drive capability.
  • To filter out noise and EMI, use a combination of passive components such as resistors, capacitors, and inductors. A pi-filter or a common-mode choke can be effective in reducing noise and EMI. Additionally, ensure that the PCB layout is designed to minimize noise coupling and radiation.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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