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OPA337NA/250G4 - Texas Instruments

Description: TEXAS INSTRUMENTS - OPA337NA/250G4 - Operational Amplifier, Single, 1 Amplifier, 3 MHz, 1.2 V/µs, 2.5V to 5.5V, SOT-23, 5 Pins

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OPA337NA/250G4 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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OPA337NA/250G4 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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OPA337NA/250G4 Details

  • Manufacturer Part Number:

    OPA337NA/250G4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    1.2 V/us

  • Supply Current-Max:

    1 mA

  • Supply Voltage Limit-Max:

    7.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA337NA/250G4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout that minimizes parasitic capacitance and inductance, with a solid ground plane and short traces. A 4-layer PCB with a dedicated analog ground plane is ideal. See TI's PCB layout guidelines for more information.
  • To ensure stability, use a gain resistor (RG) that is less than or equal to 1 kΩ, and a feedback capacitor (CF) that is greater than or equal to 10 pF. Additionally, use a compensation capacitor (CC) in parallel with RG if the gain is greater than 10. See TI's application note for more details.
  • The maximum power dissipation of OPA337NA/250G4 is 500 mW. However, this can be limited by the thermal resistance of the package and the PCB. Ensure good thermal design and heat sinking to prevent overheating.
  • Yes, OPA337NA/250G4 is rated for operation from -40°C to 125°C. However, the device's performance may degrade at high temperatures, and the maximum power dissipation may need to be derated. Consult TI's datasheet and application notes for more information.
  • Use a shielded enclosure, and ensure good PCB layout practices such as separating analog and digital circuits, using a solid ground plane, and minimizing trace lengths. Additionally, use EMI filters or shielding on input and output lines if necessary.

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OPA337NA/250G4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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