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OPA355QDBVRQ1 - Texas Instruments

Description: Automotive 2.5V, 200MHz GBW, CMOS Single Op Amp With Shutdown

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PCB Footprints
OPA355QDBVRQ1 - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006A
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3D Models
OPA355QDBVRQ1 - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV0006A
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OPA355QDBVRQ1 Details

  • Manufacturer Part Number:

    OPA355QDBVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bandwidth (3dB)-Nom:

    100 MHz

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    66 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    9000 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    300 V/us

  • Supply Current-Max:

    11 mA

  • Supply Voltage Limit-Max:

    7.5 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    450000

  • Voltage Gain-Min:

    15848.931

  • Wideband:

    YES

  • Width:

    1.6 mm

OPA355QDBVRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA355QDBVRQ1 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure EMI compliance, use a shielded enclosure, keep the device away from antennas and other EMI sources, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, use a low-pass filter on the output to reduce high-frequency noise.
  • The recommended power-on sequence for OPA355QDBVRQ1 is to apply the power supply voltage (VCC) before applying the input signal. This ensures that the device is properly biased and reduces the risk of latch-up or damage.
  • To handle thermal management, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pad on the bottom of the package. The device's thermal pad should be connected to a solid ground plane to dissipate heat efficiently.
  • The recommended input termination for OPA355QDBVRQ1 is a 1 kΩ to 10 kΩ resistor in series with the input signal, while the recommended output termination is a 100 Ω to 1 kΩ resistor in series with the output signal. This helps to reduce reflections and improve signal integrity.

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OPA355QDBVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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