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OPA356AQDBVRQ1 - Texas Instruments

Description: Automotive Catalog 2.5V, 200MHz GBW, CMOS Single Op Amp

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PCB Footprints
OPA356AQDBVRQ1 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
OPA356AQDBVRQ1 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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OPA356AQDBVRQ1 Details

  • Manufacturer Part Number:

    OPA356AQDBVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bandwidth (3dB)-Nom:

    100 MHz

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    66 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00005 µA

  • Input Offset Voltage-Max:

    9000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    300 V/us

  • Supply Current-Max:

    11 mA

  • Supply Voltage Limit-Max:

    7.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    450000

  • Voltage Gain-Min:

    10000

  • Wideband:

    YES

  • Width:

    1.6 mm

OPA356AQDBVRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA356AQDBVRQ1 involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, use a compensation capacitor (e.g., 10nF to 100nF) between the output and the inverting input. Additionally, use a low-ESR capacitor (e.g., 10uF to 100uF) between the power supply pins and ground. Avoid using long input traces and keep the feedback network impedance low.
  • The maximum power dissipation of OPA356AQDBVRQ1 is 500mW. To ensure reliable operation, keep the junction temperature (TJ) below 150°C. Use a thermal pad or heat sink if necessary.
  • Yes, OPA356AQDBVRQ1 can be used in a single-supply configuration. However, the input common-mode voltage range is limited to VCC-1.5V to VCC+0.5V. Use a voltage divider or a level-shifting circuit to ensure the input signal is within this range.
  • Use ESD protection diodes (e.g., TVS diodes) on the input and output pins. Add a series resistor (e.g., 1kΩ) to the input pins to limit the current. For overvoltage protection, use a voltage clamp or a zener diode to limit the voltage to the maximum rating (5.5V).

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OPA356AQDBVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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