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OPA360AIDCKTG4 - Texas Instruments

Description: Video Amp Single 3.3V 6-Pin SC-70 T/R

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PCB Footprints
OPA360AIDCKTG4 - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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3D Models
OPA360AIDCKTG4 - Texas Instruments  - 3D model - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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OPA360AIDCKTG4 Details

  • Manufacturer Part Number:

    OPA360AIDCKTG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SC-70, 6 PIN

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Consumer IC Type:

    VIDEO AMPLIFIER

  • Gain:

    6 dB

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    9 mA

  • Supply Voltage-Max (Vsup):

    3.3 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

OPA360AIDCKTG4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout with a symmetrical, star-grounded configuration, with the op-amp inputs and outputs routed away from noise sources and high-current paths. A dedicated analog ground plane and careful component placement can also help minimize noise and ensure optimal performance.
  • The OPA360AIDCKTG4 has built-in ESD protection, but it's still important to follow proper handling and assembly procedures to prevent damage. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment. Additionally, consider adding external ESD protection devices, such as TVS diodes, to the PCB design.
  • The maximum power dissipation for OPA360AIDCKTG4 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C. However, it's essential to perform thermal calculations and consider heat sinking or other thermal management techniques to ensure the device operates within safe limits.
  • The OPA360AIDCKTG4 is specified to operate from -40°C to 125°C, but its performance and reliability may degrade at higher temperatures. If you need to operate the device in a high-temperature environment, consider derating the power supply voltage and ensuring proper heat sinking to prevent overheating. Additionally, consult with Texas Instruments or a qualified engineer to determine the feasibility of using the device in your specific application.
  • To troubleshoot common issues with OPA360AIDCKTG4, start by reviewing the PCB layout and ensuring that it follows recommended design practices. Check for noise sources, such as switching power supplies or high-frequency signals, and ensure that the op-amp inputs and outputs are properly terminated. Use an oscilloscope to measure the output signal and look for signs of oscillation or instability. Consult the datasheet and application notes for guidance on troubleshooting and optimizing the device's performance.

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OPA360AIDCKTG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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