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OPA376AIDRG4 - Texas Instruments

Description: Op Amp Single Precision Amplifier R-R I/O ±2.75V/5.5V 8-Pin SOIC T/R

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OPA376AIDRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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OPA376AIDRG4 - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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OPA376AIDRG4 Details

  • Manufacturer Part Number:

    OPA376AIDRG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    76 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    2 V/us

  • Supply Current-Max:

    0.95 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    2.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5500

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    3.9 mm

OPA376AIDRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout that minimizes parasitic capacitance and inductance, with a solid ground plane and short traces. A 4-layer PCB with a dedicated analog ground plane is recommended. See the TI application note 'AN-1187: PCB Layout for Switching Regulators and Op Amps' for more details.
  • To ensure stability, ensure that the phase margin is greater than 45° and the gain margin is greater than 10 dB. Use the TI SPICE model or a simulation tool like TINA-TI to simulate the circuit and analyze the stability. Also, follow the recommended compensation techniques in the datasheet.
  • The OPA376AIDRG4 can drive up to 1 nF of capacitive load. However, it's recommended to limit the capacitive load to 100 pF or less to ensure stability and optimal performance.
  • Yes, the OPA376AIDRG4 is rated for operation from -40°C to 125°C. However, the device's performance may degrade at high temperatures, and the maximum junction temperature should not exceed 150°C. Ensure proper thermal management and follow the recommended thermal design guidelines.
  • Use proper shielding, grounding, and layout techniques to minimize noise and EMI. Use a low-noise power supply, and consider adding noise filters or EMI filters to the input and output stages. Also, follow the recommended layout and grounding guidelines in the datasheet.

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OPA376AIDRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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