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OPA3875IDBQ - Texas Instruments

Description: Triple 2:1 High-Speed Video Multiplexer

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OPA3875IDBQ - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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OPA3875IDBQ - Texas Instruments  - 3D model - Small Outline Packages - DBQ0016A
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OPA3875IDBQ Details

  • Manufacturer Part Number:

    OPA3875IDBQ

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    VIDEO MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage-Max (Vsup):

    -6.3 V

  • Neg Supply Voltage-Min (Vsup):

    -3 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NO/NC

  • Number of Channels:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    60 dB

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    36 mA

  • Supply Voltage-Max (Vsup):

    5 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

OPA3875IDBQ Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the OPA3875 datasheet, which includes guidelines for component placement, routing, and grounding. Additionally, TI recommends using a 4-layer PCB with a solid ground plane and a separate analog ground plane to minimize noise and interference.
  • To ensure stability, follow the recommended compensation network in the datasheet, and make sure to use a capacitor with a low equivalent series resistance (ESR) and a high-quality ceramic capacitor for the bypass capacitor. Additionally, keep the input and output traces short and away from noise sources, and use a low-impedance output load.
  • The maximum power dissipation of OPA3875IDBQ is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the operating temperature and the thermal resistance of the PCB.
  • Yes, OPA3875IDBQ is specified to operate from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to consult the datasheet for temperature-related specifications and to consider derating the power dissipation and operating conditions for high-temperature applications.
  • To protect OPA3875IDBQ from ESD and overvoltage, use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Additionally, use a voltage regulator or a voltage limiter to prevent overvoltage conditions. It's also recommended to follow proper handling and storage procedures to prevent ESD damage.

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OPA3875IDBQ Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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