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OPA387DBVT - Texas Instruments

Description: Precision Amplifiers Ultra-high precision (2 uV), zero-drift (0.003 uV/C), low-input-bias-current op amp (single)

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PCB Footprints
OPA387DBVT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV
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OPA387DBVT - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV
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OPA387DBVT Details

  • Manufacturer Part Number:

    OPA387DBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.00015 µA

  • Common-mode Reject Ratio-Min:

    110 dB

  • Common-mode Reject Ratio-Nom:

    150 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -3 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    2.8 V/us

  • Supply Current-Max:

    0.7 mA

  • Supply Voltage Limit-Max:

    3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5700

  • Voltage Gain-Min:

    1778279

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA387DBVT Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout that minimizes parasitic inductance and capacitance, keeps the input and output traces short and separate, and uses a solid ground plane to reduce noise and electromagnetic interference (EMI). A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, use a compensation capacitor (Cc) between the output and the inverting input, and a series resistor (Rs) at the output. The values of Cc and Rs depend on the specific application and can be calculated using the datasheet's stability analysis guidelines. Additionally, minimize parasitic capacitance and inductance in the layout, and use a low-ESR capacitor for the power supply decoupling.
  • The maximum power dissipation of OPA387DBVT is limited by the junction temperature (TJ) of 150°C. The power dissipation can be calculated using the formula: Pd = (Vcc x Icc) + (Vout x Iout), where Vcc is the supply voltage, Icc is the quiescent current, Vout is the output voltage, and Iout is the output current. Ensure that the calculated power dissipation is within the safe operating area (SOA) specified in the datasheet.
  • OPA387DBVT is specified to operate from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. The maximum junction temperature (TJ) is 150°C, and the device should not be operated above this temperature. Additionally, the device's offset voltage, noise, and distortion may increase at high temperatures, affecting the overall circuit performance.
  • To protect OPA387DBVT from EMI and RFI, use a shielded enclosure, keep the input and output traces short and separate, and use a common-mode choke or ferrite bead at the input. Additionally, use a low-pass filter or a pi-filter at the input to attenuate high-frequency noise. Ensure that the PCB layout is designed to minimize radiation and susceptibility to external interference.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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