Part Image

OPA388IDGKR - Texas Instruments

Description: 10MHz, CMOS, Zero-Drift, Zero-Crossover, True RRIO Precision Operational Amplifier

Download OPA388IDGKR Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
OPA388IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - OPA388IDGKR-1
click to zoom
3D Models
OPA388IDGKR - Texas Instruments  - 3D model - Small Outline Packages - OPA388IDGKR-1
click to zoom

OPA388IDGKR Details

  • Manufacturer Part Number:

    OPA388IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2017-06-22

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0007 µA

  • Bias Current-Max (IIB) @25C:

    0.00035 µA

  • Common-mode Reject Ratio-Min:

    124 dB

  • Common-mode Reject Ratio-Nom:

    138 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -3 V

  • Neg Supply Voltage-Nom (Vsup):

    -2.5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    5 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    2.4 mA

  • Supply Voltage Limit-Max:

    3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    25118864

  • Wideband:

    NO

  • Width:

    3 mm

OPA388IDGKR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA388IDGKR involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • The output capacitor should be chosen based on the desired closed-loop bandwidth, output impedance, and stability requirements. A general rule of thumb is to use a capacitor with a value between 10nF to 100nF, and a voltage rating that exceeds the maximum output voltage. TI provides guidance on output capacitor selection in the datasheet and application notes.
  • The maximum power dissipation of OPA388IDGKR is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature, but this can be derated at higher temperatures. Engineers should consult the datasheet and thermal design guidelines to ensure safe operation.
  • Yes, OPA388IDGKR is specified to operate from -40°C to 125°C, making it suitable for high-temperature environments. However, engineers should ensure that the device is properly derated for power dissipation and that the PCB design takes into account thermal management and reliability considerations.
  • Oscillations or instability issues with OPA388IDGKR can be caused by a variety of factors, including poor PCB layout, inadequate decoupling, or incorrect component selection. Engineers should consult the datasheet and application notes for troubleshooting guidelines, and consider using simulation tools or seeking support from TI's technical support team.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

OPA388IDGKR Overview

Use the download button to access the OPA388IDGKR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like OPA38, or try a keyword search, such as Operational Amplifiers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to OPA388IDGKR

Showing 0 results

OPA388IDGKR Alternates

Showing results

Image Part Number Model
Part Image OPA388IDGKT Texas Instruments

Operational Amplifier, 1 Func, 5uV Offset-Max, CMOS, PDSO8