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OPA4170AQPWRQ1 - Texas Instruments

Description: Automotive 36V, microPower, Rail-to-Rail Output, General Purpose Op Amp in MicroPackages

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OPA4170AQPWRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW (R-PDSO-G14)
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OPA4170AQPWRQ1 - Texas Instruments  - 3D model - Small Outline Packages - PW (R-PDSO-G14)
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OPA4170AQPWRQ1 Details

  • Manufacturer Part Number:

    OPA4170AQPWRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.016 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    104 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -2 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    0.155 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Min:

    316227.76

  • Wideband:

    NO

  • Width:

    4.4 mm

OPA4170AQPWRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA4170AQPWRQ1 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, use a gain resistor (Rg) that is less than or equal to 1 kΩ, and a feedback capacitor (Cf) that is less than or equal to 10 pF. Additionally, use a compensation capacitor (Cc) in parallel with Rg to improve phase margin.
  • The maximum power dissipation of OPA4170AQPWRQ1 is 1.4 W. However, this can be limited by the thermal resistance of the package and the ambient temperature. A heat sink or a thermally enhanced package may be required for high-power applications.
  • Yes, OPA4170AQPWRQ1 is rated for operation from -40°C to 125°C. However, the device's performance may degrade at high temperatures, and the maximum junction temperature should not exceed 150°C.
  • To protect OPA4170AQPWRQ1 from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite beads on the input and output lines. Additionally, use a low-pass filter or a shielding material to reduce radiated emissions.

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OPA4170AQPWRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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