- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for OPA4182IDT
- Part Number OPA4182IDT
- Manufacturer Texas Instruments
- Pin Count 14
- Part Category Integrated Circuit
- Package Category Small Outline Packages
- Footprint Name Small Outline Packages - D (R-PDSO-G14)
- Released Date Jan 4, 2023
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
OPA4182IDT Details
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Manufacturer Part Number:
OPA4182IDT
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Brand Name:
Texas Instruments
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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HTS Code:
8542.33.00.01
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Manufacturer:
Texas Instruments
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YTEOL:
15
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Amplifier Type:
OPERATIONAL AMPLIFIER
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Architecture:
VOLTAGE-FEEDBACK
OPA4182IDT Frequently Asked Questions (FAQs)
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Texas Instruments provides a recommended PCB layout in the OPA4182IDT datasheet, which includes guidelines for component placement, trace routing, and grounding. Additionally, it's recommended to use a 4-layer PCB with a solid ground plane, and to keep the input and output traces as short as possible.
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To ensure stability, it's essential to follow the recommended compensation network and component values provided in the datasheet. Additionally, make sure to decouple the power supply pins with capacitors, and use a low-ESR capacitor for the output filter. Also, avoid using long input traces and keep the feedback network as simple as possible.
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The maximum power dissipation of OPA4182IDT is dependent on the ambient temperature and the thermal resistance of the package. The datasheet provides a formula to calculate the maximum power dissipation, which is Pd(max) = (TJ(max) - TA) / θJA, where TJ(max) is the maximum junction temperature, TA is the ambient temperature, and θJA is the thermal resistance. Typically, the maximum power dissipation is around 1.4W at 25°C ambient temperature.
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Yes, OPA4182IDT can operate in high-temperature environments, but its performance and reliability may be affected. The device is specified to operate up to 125°C, but the maximum junction temperature should not exceed 150°C. At high temperatures, the device's offset voltage, noise, and distortion may increase, and the output current may decrease. It's essential to derate the power dissipation and ensure proper thermal management to prevent overheating.
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To protect OPA4182IDT from EMI and RFI, use a shielded enclosure, and ensure that the PCB layout is designed to minimize radiation and susceptibility. Use bypass capacitors on the power supply pins, and consider adding EMI filters or common-mode chokes to the input and output signals. Additionally, use a low-pass filter or a ferrite bead to filter out high-frequency noise.
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OPA4182IDT Overview
Use the download button to access the OPA4182IDT schematic symbol, PCB footprint, and 3D model.
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.