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OPA4336EA/250 - Texas Instruments

Description: Single-Supply, MicroPower CMOS Operational Amplifiers MicroAmplifier™ Series

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OPA4336EA/250 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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OPA4336EA/250 - Texas Instruments  - 3D model - Small Outline Packages - DBQ0016A
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OPA4336EA/250 Details

  • Manufacturer Part Number:

    OPA4336EA/250

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    500 µV

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.03 V/us

  • Supply Current-Max:

    0.128 mA

  • Supply Voltage Limit-Max:

    7.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    100

  • Voltage Gain-Min:

    31600

  • Wideband:

    NO

  • Width:

    3.9 mm

OPA4336EA/250 Frequently Asked Questions (FAQs)

  • A good PCB layout for the OPA4336EA/250 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended compensation network values, keep the gain resistors close to the device, and use a low-ESR capacitor for decoupling. Additionally, avoid using long input traces and keep the feedback network impedance low.
  • The maximum power dissipation of the OPA4336EA/250 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated based on the actual operating conditions.
  • The OPA4336EA/250 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the thermal management and derate the power dissipation accordingly to ensure reliable operation.
  • To protect the OPA4336EA/250 from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite beads on the input and output lines. Additionally, use a low-pass filter or a shielded cable to minimize radiated emissions.

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OPA4336EA/250 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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