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OPA567AIRHGTG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps Rail-to-Rail I/O 2A Power Amplifier

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PCB Footprints
OPA567AIRHGTG4 - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - PVQFN-12
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OPA567AIRHGTG4 - Texas Instruments  - 3D model - Quad Flat No-Lead - PVQFN-12
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OPA567AIRHGTG4 Details

  • Manufacturer Part Number:

    OPA567AIRHGTG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    QFN-12

  • Pin Count:

    12

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    S-PQCC-N12

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC12,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    YES

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Slew Rate-Nom:

    1.2 V/us

  • Supply Current-Max:

    6 mA

  • Supply Voltage Limit-Max:

    7.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    5 mm

OPA567AIRHGTG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also important to follow general high-frequency PCB design guidelines, such as keeping the signal traces short, using a solid ground plane, and avoiding vias under the device.
  • The choice of output filter depends on the specific application requirements. A simple RC filter can be used for most applications, but more complex filters like LC or active filters may be needed for higher frequency or higher power applications. TI provides some guidance on output filter design in the datasheet.
  • The maximum power dissipation of the OPA567AIRHGTG4 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated for higher ambient temperatures.
  • The OPA567AIRHGTG4 is rated for operation up to 125°C, but the device's performance and reliability may be affected at high temperatures. It's essential to follow the recommended operating conditions and derate the power dissipation accordingly.
  • The OPA567AIRHGTG4 has built-in overvoltage protection, but it's still important to follow proper PCB design and layout practices to prevent ESD damage. Additionally, consider adding external protection devices like TVS diodes or zener diodes to protect the device from overvoltage and ESD events.

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OPA567AIRHGTG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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