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OPA615IDGSR - Texas Instruments

Description: Transconductance Amplifiers Wide BW DC Restor Circuit

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OPA615IDGSR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A
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OPA615IDGSR - Texas Instruments  - 3D model - Small Outline Packages - DGS0010A
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OPA615IDGSR Details

  • Manufacturer Part Number:

    OPA615IDGSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    SAMPLE AND HOLD CIRCUIT

  • Analog Input Voltage-Max:

    3 V

  • Analog Input Voltage-Min:

    -3 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    17 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD SILVER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

OPA615IDGSR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the input and output traces as short as possible. Additionally, it's recommended to use a common-mode choke or a ferrite bead to filter out high-frequency noise.
  • To ensure stability, it's recommended to use a compensation capacitor (Cc) between the output and the inverting input pins. The value of Cc depends on the gain and bandwidth requirements, but a typical value is around 10-22pF. Additionally, it's recommended to use a low-ESR capacitor for the power supply decoupling.
  • The OPA615IDGSR can drive a maximum capacitive load of 100nF. Exceeding this limit may cause oscillations or instability. If a larger capacitive load is required, it's recommended to use a buffer stage or a dedicated line driver.
  • To protect OPA615IDGSR from overvoltage, it's recommended to use a voltage clamp or a transient voltage suppressor (TVS) diode at the input pins. For ESD protection, it's recommended to use a TVS diode or an ESD protection device at the input pins, and to follow proper ESD handling procedures during assembly and testing.
  • The OPA615IDGSR has a thermal derating of 13.9mW/°C above 25°C. This means that the maximum power dissipation decreases by 13.9mW for every degree Celsius above 25°C. It's recommended to ensure good thermal conduction and to use a heat sink if necessary.

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OPA615IDGSR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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